Our MOEMS services for you

We provide only the best for our customers

  • Optimal and efficient transition from concept phase to systems development
  • Benefit of technical know-how and experience
  • Optimal realisation of the customer projects
  • Optimal data preparation and smooth handover to selected equipment manufacturers
  • We also support issues outside main task

 

 

Clean Room

  • Cleanroom ISO class 7 (class 10,000)
  • Laminar flow box ISO class 5 (class 100)
  • Die Bonding (down to 0.18 mm edge width)
  • Wire bonding (17µm -50 µm, gold and aluminum wire)
  • Precision encapsulation
  • Precision alignment of optical components
  • Micro assembly of optical modules and functional testing
  • Thermal simulation

 

 

Die Bonder: Amadyne SAM42

Die Bonding
Highly flexible Die Bonder with small setup times and many options

  • Stamping or Dispensing of Adhesives
  • Pick & Place of bare chips from Blue tape, Waffle Pack or Gel Pack
  • Chip sizes typically 0.3 – 25 mm edge length
  • Flipping unit for Flip Chip assembly
  • 60-100 cph

 

 

Die Bonder: Hilbond DB 750

Die Bonding
Flexible and fast Die Bonder with small setup times and many available options

  • Stamping or Dispensing of Adhesives
  • Pick & Place of bare chips from Blue tape, Waffle Pack or Gel Pack
  • Chip sizes typically 0.3 – 10 mm edge length
  • 330 cph (real production)

 

 

Wire Bonder: Delvotec 6400

Wire Bonding
Flexible Ultrasonic Wedge/Wedge Bonder

  • Wire material: aluminum or gold
  • Wire diameter typ. 17-32 micrometers
  • Minimal Loop height typ. 200 micrometers (other values see COB Design Rules)
  • Substrate heating

 

 

Test: XYZTec Condor 70

Mechanical Testing

  • Pull and Shear test
  • Destructive and non destructive
  • Pull test up to 800g, Shear test up to 40kg
  • Archiving of measurement results in database
  • Recording of force-displacement-diagram

 

 

 

Dispenser: Asymtek S820

Encapsulation

  • Automatic 2-head dispensing system
  • State-of-the-art Jet technology
  • Mass calibrated dispensing
  • Vision system for precise  dispensing
  • Various valves for a wide spectrum of materials (low to high viscosity)

 

 

 

 

Micro Assembly Station

Optoelectronics Assembly
Custom design set-up for positioning and placement of optoelectronic components

  • Video microscope with motorized translation & rotation stages
  • Optical alignment relative to inner structure of components
  • Fixation with UV-curing glue